TechSpot
Today’s high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs to meet soaring demands for performance and memory bandwidth. TSMC’s current CoWoS solutions can accommodate interposers up to 2,831 mm², more than three times the size of a standard photomask reticle…
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TSMC unveils plans for giant AI chips to meet surging compute demands
Anthony Mcnaught
08:21
Today’s high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs to meet soaring demands for performance and memory bandwidth. TSMC’s current CoWoS solutions can accommodate interposers up to 2,831 mm², more than three times the size of a standard photomask reticle…
