Intel Upgrades Chip Packaging for Bigger AI
This week at the IEEE Electronic Components and Packaging Technology Conference, Intel unveiled that it is developing new chip packaging
This week at the IEEE Electronic Components and Packaging Technology Conference, Intel unveiled that it is developing new chip packaging
Naveen Verma’s lab at Princeton University is like a museum of all the ways engineers have tried to make AI
Like the industry he covers, Shawn DuBravac had already had quite a week by the time IEEE Spectrum spoke to
Although they’re a staple of sci-fi movies and conspiracy theories, in real life, tiny flying microbots—weighed down by batteries and
I like to think I can learn something about our readers from the list of most read semiconductor articles. What
Finished chips coming in from the foundry are subject to a battery of tests. For those destined for critical systems
Big-name makers of processors, especially those geared toward cloud-based AI, such as AMD and Nvidia, have been showing signs of
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