JCN Newswire
TOKYO, Jan 23, 2025 – (JCN Newswire) – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which engages in the industrial precious metals business of TANAKA, has announced the development of the AgSn TLP sheet, a sheet-type bonding material designed for die attachment in the manufacturing of power semiconductor packages…
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TANAKA PRECIOUS METAL TECHNOLOGIES Develops AgSn TLP Sheet, a Sheet-type Bonding Material for Power Semiconductors
Dion Ramage
22:21
TOKYO, Jan 23, 2025 – (JCN Newswire) – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which engages in the industrial precious metals business of TANAKA, has announced the development of the AgSn TLP sheet, a sheet-type bonding material designed for die attachment in the manufacturing of
