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South Korean memory chip giant SK Hynix will produce sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process for key clients in the second half of 2025, The Korea Economic Daily reported on Tuesday. Sources indicate that SK Hynix will partner with TSMC to release a prototype of vertically stacked HBM4 chips with a base [……
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SK Hynix to produce HBM4 with TSMC’s 3nm process, prototype in March 2025
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South Korean memory chip giant SK Hynix will produce sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process for key clients in the second half of 2025, The Korea Economic Daily reported on Tuesday. Sources indicate that SK Hynix will partner with TSMC to release a prototype of vertically stacked HBM4 chips with a base
